The photochemical etching process makes electronic packaging lids with unmatched speed and accuracy.
Fotofab offers a wide range of electronic packaging lids, or step lids, that are used in the microelectronic and fiber optic industries. Our step lids are typically made from Kovar or Alloy 42, with options of gold plating, electrolytic nickel, and electroless nickel for sealing to the package. Besides precision fabrication of the lid, Fotofab removes any tabs or burrs from the lid to ensure a smooth, flawless edge.
Our step lids are suitable for your fiber optic device, hybrid circuit, image sensor, laser diode package, RF microwave package, MEMS optical devices, SAW filters, X-tal oscillators, SMD package, and more.